Flexus 2320-S
Function
The Flexus determines the stress by measuring the substrate curvature before and after thin film deposition. The stress is calculated from the change in substrate curvature. The tool enables 3D mapping of the stress using multiple measurements for different wafer orientations. Stress as a function of temperature can also be measured.
Materials and Gasses
N2 is available for measurements at elevated temperatures.
Wafer Dimension
Samples accepted in range from 5 to 200 mm.
Temperature Range
Room Temperature to 500ºC.
Contamination
The tool is used for Non-contaminated samples. Contaminated samples can be measured with special precautions.
Restrictions
NA
