Eichhorn MX 203-6
Function
The Eichhorn measures the wafer thickness, bow and warp on fixed places using capacitive sensors. It can be used for wafers in the thickness range 300-900 µm.
Materials and Gasses
NA
Wafer Dimension
100, 125 and 150 mm. The number of measurement points is 17, 25 and 33 respectively.
Temperature Range
Room Temperature only.
Contamination
Non-contaminated wafers only.
Restrictions
NA
