AC Metal 2

Apparatus

     

AC450 No. 9

Supplier

 

Alliance Concept

Location

 

P.00.390

Main purpose

 

Sputter deposition

System layout

 

RF magnetron sputter deposition (4 x 107,mm target)

RF sputter etching 

Gasses

 

Ar, N2

Power supply

 

600W Huttinger RF source for deposition

300 W Huttinger RF source for sputter etch

Process information

  standard materials: Nb, MoRe, AlSi(99%/1%), Ti
optional materials: Al, TiN (reactive)
NOTE: superconductors in AC-Metal 2
Facilities   static and dynamic deposition
reactive sputtering (with N2)

Specimen

 

max. 100mm wafers, small pieces allowed

Equipment owner

 

Marinus Fischer

m.fischer@tudelft.nl

+31 628906207

 

Bas van Asten (back-up)

b.vanasten@tudelft.nl

+31 642481091