AC Dielectric
Apparatus |
| AC450 No. 16 |
Supplier | Alliance Concept | |
Location | P.00.330 | |
Main purpose | Sputter deposition | |
System layout | RF magnetron sputter deposition (4x 4 inch target) RF sputter etching
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Gasses | Ar, N2, O2 | |
Power supply | 600W Huttinger RF source for deposition 300 W Huttinger RF source for sputter etch
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Process information | “standard” materials: Si3N4, SiO2, HfO2, Al2O3 available on request: AlN
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Facilities | static and dynamic deposition reactive sputtering (N2 and O2) RGA to analyze background pressure of process chamber
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Specimen | max. 100mm wafers, small pieces allowed | |
Equipment owner | Marinus Fischer +31 628906207
Bas van Asten (back-up) +31 642481091 |