Trikon Sigma 204
The Trikon Sigma 200 is a sputtering machine. It can be used for sputter deposition of metals (Al, AlSi1%, Cr, Cu, Mo, Ni, Ti, Zr) and semiconductors (Ge, Si). Oxides and nitrides (AlOx, AlNx, SiO2, TiN, ZrN) can also be deposited using reactive sputtering. Two materials are always available: AlSi1% in module DepA and Ti (and TiN) in DepB. The other targets are installed upon request in DepC. There is also a dedicated module (HSE) for degassing of the wafers and for sputter etch removal of native aluminium oxide. The dealer with a robot handler is used to move the wafers in vacuum from one module to another. It can load two cassettes each with up to 25 wafers.
- Al, AlSi1%, Cr, Cu, Mo, Ni, Ti, Zr, Ge, Si (with relative oxides and nitrides)
- Ar (all modules), N2 (DepB and DepC), O2 (only DepC)
Wafer handling is setup for 100 mm wafers. Smaller size samples can be handled using transport wafers.
Standard deposition temperature is 350C. Depositions can also be done at room temperature. In case of using transport wafers, the deposition temperature is limited to 25C.
NON Contaminated tool. Red metals can be deposited using the dedicated cassette. Depositions on contaminated wafers can be done on the red-metal transport wafers. In both cases an approved flowchart and additional training is required.
Not allowed:
- LPCVD or PECVD TEOS on the backside of the wafer
- Organic materials at the backside of the wafer
Limited usage
- RF sputter etch
- Only allowed with the following materials exposed: AlSi, pure Al, LPCVD or PECVD silicon oxide / nitride
- 2-50% Al(Si) exposed: use 1 oxide wafer with recipe Only_RF_xxC
- >50% Al(Si) exposed: use 2 oxide wafers with recipe Only_RF_xxC
- Transport wafers
- Required for wafers with membranes or through wafer holes
- Processing temperature limited to room temperature
- Processing with organic materials
- Approved flowchart required
- LUR test for1 wafer per batch
- Transparent wafers: sensor needs to be switched off (ask staff)
