CHA Solution
The CHA Solution is used for e-beam evaporation. The materials that are currently available for evaporation are: Al, Al2O3, Au, Co, Cr, Fe, HfO2, Mo, Ni, Pd, Pt, Si, Ta, Ti. Typical deposition rates are 1-3 Å/s.
- Al, Al2O3, Au, Co, Cr, Fe, HfO2, Mo, Ni, Pd, Pt, Si, Ta, Ti
- N2 (only used for venting)
For a single evaporation run 7 wafers 100 mm size or 3 wafers 150 mm size or 2 square plates 150 mm. Capton tape can be used to stick smaller samples on a silicon wafer.
Standard deposition temperature starts at room temperature and can increase up to 100C.
Contaminated tool. The tool is used for many red metals. Two categories of contaminated metals are applicable:
- Depositions with Gold,
- Depositions without Gold.
A dedicated set of shutters and Dome is available for each of these categories. Exchange of the shutters needs to be done by the staff.
NA
