EVG 101 Spraycoater
The EVG101 is an ultrasonic spraycoating system. It is able to coat conformal resist films onto extreme topography, where spincoating would result in resist defects and insufficient edge coverage. It features a programmable dispense arm that moves across the spinning wafer while the low-viscosity photoresist is vaporized by the ultrasonic vibrations of the spray nozzle. The system has a list of coating recipes available for cleanroom users.
Available positive photoresist: AZ9260 (diluted with MEK and PGMEA).
Available negative photoresists: AZ nLOF 2070 (diluted with MEK and PGMEA).
Only one syringe with diluted resists can be installed in the syringe dispense pump at a time. PGMEA can also be used for automatic bowl cleaning.
Maximum spinspeed: 10'000 rpm.
Standard substrates: 4 inch (100 mm) wafers, technically configurable for 6 inch (150 mm) wafers. Consult the tool responsible before processing wafers with through etched holes or deep cavities on the backside.
Room Temperature only.
SEMI-clean tool: there are dedicated wafer chucks for non-contaminated wafers and contaminated wafers.
Throughput: Process dependent; typical coating recipes can take over 10 minutes per wafer.
