Search
Call for proposals on AI-Augmented Engineering Education
Call for proposals on AI-Augmented Engineering Education As AI is radically changing the design, engineering and science processes, the…
CHA Solution
Function The CHA Solution is used for e-beam evaporation. The materials that are currently available for evaporation are: Al, Al2O3, Au, Co,…
Oxford PlasmaPro100
Function PlasmaLab 100 is an Inductively Coupled - Plasma Enhanced Chemical Vapor Deposition ( ICP-PECVD ), which is used for thin film…
Parylene Deposition System 2
Function The Parylene Deposition System 2 is a Chemical Vapor Deposition ( CVD ) machine that allows the uniform deposition of Parylene C, a…
Diener Atto Plasma Reactor
Function The Diener Atto Plasma Reactor is a low power (max 200W) Oxygen plasma reactor employed for surface activation. The low power…
PVA Tepla 360M
Function The PVA Tepla GigaBatch 360M is a plasma asher used to remove photoresist from wafers before wet chemical cleaning. It employs a…
PVA Tepla 300
Function The PVA Tepla 300 is a plasma asher used to remove photoresist from wafers before wet chemical cleaning. It employs a frequency of…
L. (Livio) Carzana
- L.Carzana@tudelft.nl
- 62.9.15
Trailblazers of the wireless revolution
A vision of the future: a completely wireless world, in the fields of both communications and energy.
B. (Bojan) Bogojević
- B.Bogojevic@tudelft.nl
- 23.HG 1.54