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Call for proposals on AI-Augmented Engineering Education

Call for proposals on AI-Augmented Engineering Education As AI is radically changing the design, engineering and science processes, the…

CHA Solution

Function The CHA Solution is used for e-beam evaporation. The materials that are currently available for evaporation are: Al, Al2O3, Au, Co,…

Oxford PlasmaPro100

Function PlasmaLab 100 is an Inductively Coupled - Plasma Enhanced Chemical Vapor Deposition ( ICP-PECVD ), which is used for thin film…

Parylene Deposition System 2

Function The Parylene Deposition System 2 is a Chemical Vapor Deposition ( CVD ) machine that allows the uniform deposition of Parylene C, a…

Diener Atto Plasma Reactor

Function The Diener Atto Plasma Reactor is a low power (max 200W) Oxygen plasma reactor employed for surface activation. The low power…

PVA Tepla 360M

Function The PVA Tepla GigaBatch 360M is a plasma asher used to remove photoresist from wafers before wet chemical cleaning. It employs a…

PVA Tepla 300

Function The PVA Tepla 300 is a plasma asher used to remove photoresist from wafers before wet chemical cleaning. It employs a frequency of…

L. (Livio) Carzana

Trailblazers of the wireless revolution

Trailblazers of the wireless revolution

A vision of the future: a completely wireless world, in the fields of both communications and energy.

B. (Bojan) Bogojević