PVA Tepla 300
Function
The PVA Tepla 300 is a plasma asher used to remove photoresist from wafers before wet chemical cleaning. It employs a frequency of 2.45GHz in order to create the rective plasma reducing the bombardment on the wafer.
Gasses
O2, Ar
Wafer Dimension
Standard substrates: 4 to 6 inch (100-150 mm) wafers, smaller samples can be introduced on a carrier wafer.
Temperature Range
NA
Contamination
Contaminated tool: only for contaminated wafers (i.e. red metals).
Remarks
NA
