PVA Tepla 360M
Function
The PVA Tepla GigaBatch 360M is a plasma asher used to remove photoresist from wafers before wet chemical cleaning. It employs a frequency of 2.45GHz in order to create the rective plasma reducing the bombardment on the wafer. An infrared sensor is used to check the real time temperature of the wafer, in order to reduce the temperature impact a Faraday cage can be employed.
Gasses
O2, CF4, Ar
Wafer Dimension
Standard substrates: 4 to 6 inch (100-150 mm) wafers, smaller samples can be introduced on a carrier wafer.
Temperature Range
NA
Contamination
Non-Contaminated tool: only for non-contaminated wafers.
Remarks
NA
