Oxford PlasmaPro100
Function
PlasmaLab 100 is an Inductively Coupled - Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD), which is used for thin film deposition. This tool is used for deposition of dielectrics and semiconductors such as SixNy, SixCy, SixOy, a-Si, at low to high temperatures.
Gasses
SiH4, N2, CH4, H2, CF4, Ar, O2
Wafer Dimension
Standard substrate: 4inch wafers but smaller samples can be used on top of a carrier. Substrate acceptable thickness range: 200 µm to 1 mm.
Temperature Range
50C to 300C
Contamination
Semi-Clean tool: only some Contaminated wafers can be processed in this tool by employing a special carrier. Discuss with the responsible person for this tool if your sample can be introduced in the machine or not.
Restrictions
NA
