Diener Atto Plasma Reactor
Function
The Diener Atto Plasma Reactor is a low power (max 200W) Oxygen plasma reactor employed for surface activation. The low power allows the preservation of the polymeric layers, breaking only the surface dangling bonds of them. It is usually employed to bond two polymers on top of eachother, to activate a wafer surface before spin coating of polymers.
Materials and Gasses
O2, N2
Wafer Dimension
Standard substrates: 4 inch (100 mm) wafers, 6 inch (150 mm) wafers. Smaller samples can be used.
Temperature Range
Room Temperature.
Contamination
SEMI-clean tool: specific holders for contaminated and non-contaminated samples.
Remarks
NA
