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Call for proposals on AI-Augmented Engineering Education As AI is radically changing the design, engineering and science processes, the…

Function The Trikon Sigma 200 is a sputtering machine. It can be used for sputter deposition of metals ( Al, AlSi1%, Cr, Cu, Mo, Ni, Ti, Zr…

Function The CHA Solution is used for e-beam evaporation. The materials that are currently available for evaporation are: Al, Al2O3, Au, Co,…

Function PlasmaLab 100 is an Inductively Coupled - Plasma Enhanced Chemical Vapor Deposition ( ICP-PECVD ), which is used for thin film…

Function The Parylene Deposition System 2 is a Chemical Vapor Deposition ( CVD ) machine that allows the uniform deposition of Parylene C, a…

Function The Diener Atto Plasma Reactor is a low power (max 200W) Oxygen plasma reactor employed for surface activation. The low power…

Function The PVA Tepla GigaBatch 360M is a plasma asher used to remove photoresist from wafers before wet chemical cleaning. It employs a…

Function The PVA Tepla 300 is a plasma asher used to remove photoresist from wafers before wet chemical cleaning. It employs a frequency of…

Here are reported all the tools employable at Else Kooi Laboratory for Packaging & Assembly. If you have concerns or questions about any…