Manual Spin Coater
The Manual Coating, Baking and Developing has to be employed once working with non-standard photoresists and polymers but also for fragile or contaminated wafers. These tools are of extreme importance if working with membranes, polymers or with contaminated wafers. Many photoresists, polymers and developers have been already approved and can be employed in EKL. In the following you will find a list of the most common chemicals employed in this area.
The most common chemicals employed for manual coating and development are:
Positive Photoresists: SPR3012, AZ3027, AZ10XT, AZ12XT, AZ40XT.
Negative Photoresists: AZ nLOF 2020.
Polymers: Polyimide, SU8, PDMS.
Developers: MF322, AZ 400K, AR 300-35, PEGMEA.
Standard substrates: 4 inch (100 mm) wafers, technically configurable for 6 inch (150 mm) wafers.
Spin-coating and Development: Room Temperature.
Baking: from RT to 200C.
SEMI-clean tool: specific chucks and hotplates are present for both contaminated and non-contaminated wafers.
SDS: Before spin-coating, baking and developing, read the Technical and the Safety Data Sheet of each chemical you are going to employ. You can find all these data on the NIS system.
