SCIA

Apparatus

SCIA Mill 150

Supplier

SCIA systems

Location

P.00.390

Function

Ion milling sputter etching

Gasses

Ar (O2)

Sources

ECR Ion Beam Source

Cooling system

 

System layout

Main chamber with LoadLock

Chuck

He back side pressure, table rotation 5-20 rpm, table tilt angle 0-160 degrees

Process information

All materials are allowed

Facilities

Hiden SIMS End Point Detector

Specimen

Max. 100mm wafers, small pieces allowed

Equipment owner

C.R.  de Boer
c.r.deboer@tudelft.nl
+31 652169001

 

 

 

+31 6