SCIA
Apparatus | SCIA Mill 150 |
Supplier | SCIA systems |
Location | P.00.390 |
Function | Ion milling sputter etching |
Gasses | Ar (O2) |
Sources | ECR Ion Beam Source |
Cooling system |
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System layout | Main chamber with LoadLock |
Chuck | He back side pressure, table rotation 5-20 rpm, table tilt angle 0-160 degrees |
Process information | All materials are allowed |
Facilities | Hiden SIMS End Point Detector |
Specimen | Max. 100mm wafers, small pieces allowed |
Equipment owner | C.R. de Boer
+31 6 |