ALCATEL AMS 110
Function
The ALCATEL AMS 110 is a ICP-RIE tool that allows both Reactive Ion Etching (RIE) and Deep Reactive Ion Etching (DRIE). This machine allows the etching of several different materials such as: semiconductors (Si, SiC), dielectrics (SixOy, SixNy), polymers (PDMS, PI,...).
Gasses
SF6, C4F8, He, Ar, O2, CH4
Wafer Dimension
Standard substrates: 4 inch (100 mm) wafers, smaller samples can be introduced on a carrier wafer. Substrate acceptable thickness range: 200 µm – 1200 µm.
Wafers with through etched features or deep cavities on the backside may require to be placed on carrier wafers.
Temperature Range
-40C to 40C.
Contamination
Contaminated tool: only for contaminated wafers (i.e. red metals).
Remarks
NA
