EVG bonder

Apparatus

    

EVG501

Supplier

 

EVgroup, www.evg.com

Location

 

P.00.390

Function

 

Wafer-to-wafer bonding and stamp-to-wafer hot embossing

System specifications

 

Diffusion bonding

Anodic bonding

Thermocompression bonding

Adhesive bonding

Hot embossing

 

Chuck

 

Max. 4 inch, smaller pieces allowed (with reduced compression force)

System specifications

 

For wafer to wafer alignment  EVG620 is needed

Specimen

 

Max. 4 inch wafer, min. 0.8 m2 sample

Equipment owner

 

 

 

+31 6

 

Bas van Asten (back-up)

b.vanAsten@tudelft.nl

+31 642481091