EVG bonder
Apparatus |
| EVG501 |
Supplier | EVgroup, www.evg.com | |
Location | P.00.390 | |
Function | Wafer-to-wafer bonding and stamp-to-wafer hot embossing | |
System specifications | Diffusion bonding Anodic bonding Thermocompression bonding Adhesive bonding Hot embossing
| |
Chuck | Max. 4 inch, smaller pieces allowed (with reduced compression force) | |
System specifications | For wafer to wafer alignment EVG620 is needed | |
Specimen | Max. 4 inch wafer, min. 0.8 m2 sample | |
Equipment owner |
+31 6
Bas van Asten (back-up) +31 642481091 |