Disco dicer
Apparatus |
| DAD 3220 |
Supplier | Disco Hi-Tec Europe GMbH; www.disco.co.jp | |
Location | P.00.390 | |
Function | Machining of semiconductor, metal or dielectric wafer shape substrates | |
System specifications | Synchro spindle (3.000-40.000 RPM) Automatic kerf check function Automatic micro alignment with high magn. Microscope Non contact setup of diamond coated blades
| |
Cooling system | ESD reducing cooling liquid (DI water with CO2 bubbler) | |
Chuck | 6 inch porous ceramic table | |
System specifications | Saw cuts down to 30 um Die sizes down to 0.5 mm
| |
Specimen | Max. 4 inch (100mm) wafer, small pieces allowed | |
Equipment owner | Anja van Langen A.K.vanLangen-Suurling@tudelft.nl +31 650836333
(back-up)
+31 6 |