Disco dicer

Apparatus

    

DAD 3220

Supplier

 

Disco Hi-Tec Europe GMbH; www.disco.co.jp

Location

 

P.00.390

Function

 

Machining of semiconductor, metal or dielectric wafer shape substrates

System specifications

 

Synchro spindle (3.000-40.000 RPM)

Automatic kerf check function

Automatic micro alignment with high magn. Microscope

Non contact setup of diamond coated blades

 

Cooling system

 

ESD reducing cooling liquid (DI water with CO2 bubbler)

Chuck

 

6 inch porous ceramic table

System specifications

 

Saw cuts down to 30 um

Die sizes down to 0.5 mm

 

Specimen

 

Max. 4 inch (100mm) wafer, small pieces allowed

Equipment owner

 

Anja van Langen

A.K.vanLangen-Suurling@tudelft.nl

+31 650836333

 

 (back-up)

 

+31 6