Tepla 300

Apparatus

PVA Tepla 300

Supplier

Tepla AG

Location

P.00.350

Function

Wafer stripping (photo resists, e-beam resists)

Gasses

O2,CF4

Sources

Magnetron source

Cooling system

No substrate cooling

System layout

Batch chamber

Chuck

Pyrex holder with faraday grid

Process information

O2 plasma, O2/CF4 plasma (for Si containing resists)

Facilities

-

Specimen

Max. 100mm wafers, small pieces allowed

Equipment owner

Ing. C.R. de Boer
c.r.deboer@tudelft.nl
+31 652169001

 

  (back-up)

 

+31 6