Sentech F1

Apparatus

Sentech Etchlab 200

Supplier

Sentech Instruments

Location

 

P.00.390

Function

RIE plasma etching of Si, dielectric layers and some metals

Gasses

SF6, O2, He, Ar

Sources

RF generator 13.56 MHz 600W air cooled

Cooling system

not actively fan cooling

System layout

Direct load i.e. insert sample via top-lid

Chuck

200 mm Electrode is covered with a 200mm quartz plate

Process information

Si , W , Ge , NbTiN , Si3N4 , SiO2, anisotropic photoresist etch, descumm

Facilities

Sentech laser interferometer SLI670(nm) plus software

Specimen

Max. 200 mm wafers, smaller pieces possible

Equipment owner

Ing. Charles de Boer
C.R.deBoer@tudelft.nl
+31 652169001

 

  (back-up)

 

+31 6