Oxford Instruments Estrelas
Apparatus | Plasma Pro 100 Estrelas |
Supplier | Oxford Instruments |
Location | P.00.350 |
Function | Dry etching of Silicon: Bosch process and Cryo process |
Gasses | SF6, C4F8, O2, CH4, He |
Sources | LF 300 W, RF 600 W, ICP RF 8kW |
Cooling system | Liquid nitrogen or chiller, -150 C, 70 deg C |
System layout | Inductive coupled plasma chamber with loadlock |
Chuck | Mechanical AlOx-clamping plate, electrode with Helium backside flow |
Process information | SF6/C4F8 Bosch process ranging from fast etching (>25 um/min) to precise etching (< 25 nm scallops) SF6/O2 Cryo process for high precision etching SiO2 mask opening (CHF3) W etch and NbTiN etch |
Facilities | LN2 barrel can be connected by user, system default in chiller mode |
Specimen | Max. 100mm wafers, small pieces allowed |
Equipment owner | Ing. C.R. de Boer
(back-up)
+31 6 |