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Function The SPTS Vapor HF is used to etch oxides layers, usually employed as sacrificial layers, to release structures via dry vapor…

Function The Avenger Rinser Dryer is a tool employed for drying the wafers after being wet chemically processed and rinsed in a water baths.…

Function The Woollam ellipsometer is used for measuring the thickness of transparent layers. Ellipsometry particularly useful to measure the…

Function The Eichhorn measures the wafer thickness, bow and warp on fixed places using capacitive sensors. It can be used for wafers in the…

Function The CDE uses a 4-point probe to measure the sheet resistance. The automated stage enables measurement of the sheet resistance…

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Function The CHA Solution is used for e-beam evaporation. The materials that are currently available for evaporation are: Al, Al2O3, Au, Co,…

Function PlasmaLab 100 is an Inductively Coupled - Plasma Enhanced Chemical Vapor Deposition ( ICP-PECVD ), which is used for thin film…

Function The Parylene Deposition System 2 is a Chemical Vapor Deposition ( CVD ) machine that allows the uniform deposition of Parylene C, a…

Function The Diener Atto Plasma Reactor is a low power (max 200W) Oxygen plasma reactor employed for surface activation. The low power…