EVG 120
The EVG120 is an automatic coater-developer track. It has two tracks. One track is for coating wafers with photoresist, while the other is for developing wafers with exposed photoresist layers. Each track can process batches of up to 25 wafers at a time, and both tracks can be used simultaneously. A large number of standardized coating and development recipes are available for cleanroom users.
Coater track:
Available positive photoresists: Megaposit SPR3012, AZ ECI 3027, AZ 10XT.
Typical positive resist thickness range: 1 – 12 µm.
Available negative photoresists: AZ nLOF 2020.
Typical negative resist thickness range: 1,5 – 6 µm.
Maximum spinspeed: 10.000 rpm.
Backside Rinse (BSR) and Edge Bead Removal (EBR) options using PGMEA solvent. Consult the tool responsible regarding the availability of the edge handling option for coating.
Developer track:
Available developer agent: Microposit MF-322 Developer.
Development method: spray wetting followed by puddle development.
Maximum spinspeed: 4.000 rpm.
Backside Rinse (BSR) using DI water. Consult the tool responsible regarding the availability of the edge handling option for development.
Hotplates and coolplates:
HMDS vapor priming hot plate at 130 °C.
6 programmable hotplates with a maximum temperature of 150 °C, used for proximity (soft or hard) baking at 100 µm from the hotplate surface.
Standard substrates: 4 inch (100 mm) wafers, technically configurable for 6 inch (150 mm) and 8 inch (200 mm) wafers.
Substrate acceptable thickness range: 200 µm – 1200 µm. Consult the tool owner before processing wafers with through etched holes or deep cavities on the backside.
The standard hotplate and coolplate temperatures are as follows:
HMDS vapor priming hotplate: 130 °C.
Softbake hotplates (2x): 95 °C.
Hardbake hotplates (2x): 100 °C.
Post Exposure Bake (PEB) hotplates (2x): 115 °C.
Coolplates (2x): 15 °C.
SEMI-clean tool: by default, only non-contaminated wafers can be used. Ask the tool owner for permission to process wafers that only have (red metal) contamination on the top of the wafer. The edges and the bottom of wafers always need to be free of any contamination.
Throughput:
Coating standard layers (including HMDS vapor priming): ≤ 20 wafers/hour
Developing standard layers: ≤ 19 wafers/hour
