Cleanrooms
Wet processes
- Cleaning
- Texturing
- NAOS
Dry processes
- Reactive Ion Etching
- Bosch process (high aspect-ratio etching)
Wet/dry processes
- Slurry-based CMP (Chemical-Mechanical Planarization)
Deposition techniques
- APCVD - Atmospheric pressure
- LPCVD - Low pressure
- RF-PECVD - Radio Frequancy Plasma Enhanced
- EPT-CVD - Expanding Thermal Plasma
- PVD - Physical Vapour Deposition
- Epitaxy
- Evaporation
- RF magnetron sputtering
- ALD (Atomic Layer Deposition)
Doping techniques
- Diffusion (POCl3, B2H6)
- Temperature-controlled Implantation (P, B, BF2)
- PECVD in-situ
- Epitaxy in-situ (p-type)
Annealing techniques
- Furnaces (N2, FG)
- Rapid Thermal Annealing (N2, FG)
Oxidation
- Wet
- Dry
Photolithography
- Feature size < 5 micron
Substrate size
- Wafers: 4 inch (circular shape)
- Quarts: 4 inch
- Glass sheet: max 10 x 10 cm2
Affiliations
