Publications

• 2024

  20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

  Xinrui Ji / Leiming Du / Henk Van Zeijl / Guoqi Zhang / Jaber Derakhshandeh / Eric Beyne

• 2024

  Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures

  Jiarui Mo / Gerald J.K. Schaffar / Leiming Du / Verena Maier-Kiener / Daniel Kiener / Sten Vollebregt / Guoqi Zhang

• 2024

  Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction

  Yaqian Zhang / Leiming Du / Olof Bäcke / Sebastian Kalbfleisch / Guoqi Zhang / Sten Vollebregt / Magnus Hörnqvist Colliander

• 2024

  Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

  Dong Hu / Leiming Du / Markus Alfreider / Jiajie Fan / Daniel Kiener / Guoqi Zhang

• 2024

  Multi-parameters optimization for electromigration in WLCSP solder bumps

  Leiming Du / Shanliang Deng / Zhen Cui / René Poelma / Caroline Beelen-Hendrikx / Kouchi Zhang

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