Publications

• 2014

  MIP plasma decapsulation of copper¿wired semiconductor devices for failure analysis

  J Tang

• 2013

  Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

  J Tang / CH Chen / SK Liang / EGJ Reinders / CTA Revenberg / JBJ Schelen / CIM Beenakker

• 2012

  Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

  J Tang / EGJ Reinders / CTA Revenberg / JBJ Schelen / CIM Beenakker

• 2012

  Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

  J Tang / D Gruber / JBJ Schelen / H-J Funke / CIM Beenakker

• 2012

  Flexible system for real-time plasma decapsulation of copper wire bonded ic packages

  J Tang / JBJ Schelen / CIM Beenakker

• More publications