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Wet Etching line

Function The Wet Etching line is a series of pre-made chemical baths employed for the wet chemical etching of semiconductors (poly-Si),…

SEM Hitachi Regulus 8230

Function The Hitachi Regulus 8230 is a Scanning Electron Microscope (SEM). The SEM is used for imaging samples with electrons. The…

SPTS Vapor HF

Function The SPTS Vapor HF is used to etch oxides layers, usually employed as sacrificial layers, to release structures via dry vapor…

Avenger Rinser Dryer

Function The Avenger Rinser Dryer is a tool employed for drying the wafers after being wet chemically processed and rinsed in a water baths.…

Woollam M-2000UI

Function The Woollam ellipsometer is used for measuring the thickness of transparent layers. Ellipsometry particularly useful to measure the…

Eichhorn MX 203-6

Function The Eichhorn measures the wafer thickness, bow and warp on fixed places using capacitive sensors. It can be used for wafers in the…

CDE ResMAP 178

Function The CDE uses a 4-point probe to measure the sheet resistance. The automated stage enables measurement of the sheet resistance…

Call for proposals on AI-Augmented Engineering Education

Call for proposals on AI-Augmented Engineering Education As AI is radically changing the design, engineering and science processes, the…

Trikon Sigma 204

Function The Trikon Sigma 200 is a sputtering machine. It can be used for sputter deposition of metals ( Al, AlSi1%, Cr, Cu, Mo, Ni, Ti, Zr…

CHA Solution

Function The CHA Solution is used for e-beam evaporation. The materials that are currently available for evaporation are: Al, Al2O3, Au, Co,…