Deposition

This page contains the materials that can be deposited in one of the PVD or CVD tools. For the actual status of targets and precursors in the equipment please check the reservation system or ask the equipment owner.

1. PVD

1.1 Sputtering

Al, AlSi (1%), AIN, Al₂O₃B, Cr, Ge, ITO, Mo, MoRe, Nb, Ni, NiCr, Si, SiO₂, Si₃N₄ Ti, W

 

1.2 Evaporation

Al, Al₂O₃, Ag, Au, AuPd, C, Co, Cr, Cu, Cu₂O, Ge, Mo, Ni, NiCr, Pt, Si, SiO₂, Ti, TiO₂, V, W

 

2. CVD

2.1 Thermal CVD

SiO₂ by oxidation (Tempress tube 2)

Si₃N₄ stoichiometric or low-stress (Tempress tube 4)

CNT's, graphene (First Nano)

 

2.2 PE-CVD

SiO₂, Si₃N₄, SiC, a-Si

 

2.3 ALD

Al₂O₃, AIN, TiO₂, TiN, HfO₂, SiO₂, Nbn, Nb₂O₅, Ta₂O₅ and Pt