Ir. J. Tang
Ir. J. Tang
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Publicaties
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2014
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2013
Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages
J Tang / CH Chen / SK Liang / EGJ Reinders / CTA Revenberg / JBJ Schelen / CIM Beenakker
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2012
Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma
J Tang / EGJ Reinders / CTA Revenberg / JBJ Schelen / CIM Beenakker
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2012
Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation
J Tang / D Gruber / JBJ Schelen / H-J Funke / CIM Beenakker
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2012
Flexible system for real-time plasma decapsulation of copper wire bonded ic packages
J Tang / JBJ Schelen / CIM Beenakker
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