Recipe
Gasses: | |
BCl3 | 10 sccm |
Cl2 | 10 sccm |
N2 | 10 sccm |
Pressure | 1.00 Pa |
RF Power | 50 W |
Substrate temperature | ambient |
Etch characteristics
Etch rate: 30 nm/min |
Gasses: | |
BCl3 | 10 sccm |
Cl2 | 10 sccm |
N2 | 10 sccm |
Pressure | 1.00 Pa |
RF Power | 50 W |
Substrate temperature | ambient |
Etch rate: 30 nm/min |