Publicaties

• 2024

  Multi-parameters optimization for electromigration in WLCSP solder bumps

  Leiming Du / Shanliang Deng / Zhen Cui / René Poelma / Caroline Beelen-Hendrikx / Kouchi Zhang

• 2024

  Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment

  Henry A. Martin / Edsger C.P. Smits / René H. Poelma / W.D. van Driel / GuoQi Zhang

• 2024

  Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

  Xiao Hu / Jianlin Huang / René H. Poelma / Willem Dirk van Driel / Guoqi Zhang

• 2024

  Warpage deformation analysis of AMB ceramic substrates in power modules

  Dong Hu / Chieh Wang / Zichuan Li / Nikhil Gupta / René H. Poelma / Ziliang Shi / Jiajie Fan / Guoqi Zhang

• 2023

  Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application

  Henry Martin / Marcia Reintjes / Dave Reijs / Sander Dorrestein / Martien Kengen / Sebastien Libon / Edsger Smits / Xiao Tang / Marco Koelink / Rene Poelma / Willem Van Driel / Guo Qi Zhang

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