L. Du
L. Du
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Publicaties
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2024
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
Xinrui Ji / Leiming Du / Henk Van Zeijl / Guoqi Zhang / Jaber Derakhshandeh / Eric Beyne
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2024
Evaluating the electromigration effect on mechanical performance degradation of aluminum interconnection wires
A nanoindentation test with molecular dynamics simulation study
Shuo Feng / Leiming Du / Zhen Cui / Xi Zhu / Xuejun Fan / Guoqi Zhang / Jiajie Fan -
2024
Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
Jiarui Mo / Gerald J.K. Schaffar / Leiming Du / Verena Maier-Kiener / Daniel Kiener / Sten Vollebregt / Guoqi Zhang
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2024
Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
Yaqian Zhang / Leiming Du / Olof Bäcke / Sebastian Kalbfleisch / Guoqi Zhang / Sten Vollebregt / Magnus Hörnqvist Colliander
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2024
Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
Dong Hu / Leiming Du / Markus Alfreider / Jiajie Fan / Daniel Kiener / Guoqi Zhang
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