Publicaties

• 2024

  20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

  Xinrui Ji / Leiming Du / Henk Van Zeijl / Guoqi Zhang / Jaber Derakhshandeh / Eric Beyne

• 2024

  Effects of die top system and trenches on large thin die mechanical robustness

  Nikhil Gupta / René Poelma / GuoQi Zhang / W D van Driel / HW van Zeijl

• 2023

  A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments

  Romina Sattari / Henk Van Zeijl / Guoqi Zhang

• 2023

  Degradation of silicone-based sealing materials used in microelectronics

  Maryam Yazdan Mehr / Pejman Hajipour / H. van Zeijl / W.D. van Driel / Thierry Cooremans / Francois De Buyl / G.Q. Zhang

• 2023

  Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials

  Romina Sattari / Henk van Zeijl / Guoqi Zhang

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