FEI FIB/SEM Helios G4 CX
Apparatus |
| FEI Helios G4 CX |
Supplier | FEI; www.fei.com | |
Location | TN D016 (VLLAIR) | |
Function | Imaging, nanofabrication, TEM lamella preparation and 3D slice and view | |
Main purpose | Nano Fabrication by ion milling Ion or electron beam induced deposition TEM lamella preparation in semi-automatic workflow 3D cross sectioning by slice and view | |
Main characteristics | SEM: FEG, 0.2-30kV, resolution 1nm FIB1: liquid GA ion source, 5-30 kV, 1 pA-50nA, spot > 10nm FIB2: multi beam gas injection system for deposition of W, SiO2 and Pt, and for etching by XeF2 TEM lamella preparation with easy lift system Slice and view including 3D reconstruction sofware | |
Facilities | 5-axes micromanipulator (Easy Lift EX) EDX Low energy ion source (Ar, Xe, Ne, O2, H2) 10-500 V | |
Specimen | Max. 4 inch in diameter, max 10 mm thickness | |
Equipment owner | Hozanna Miro +31 650559998
Lodi Schriek (back-up) +31 634321293 |